NVIDIA and Broadcom are advancing 3D integrated circuits (ICs) for optoelectronic fusion, aiming to integrate optical interconnects directly into chip packages. This technological shift addresses the escalating power consumption and latency bottlenecks in high-speed AI networking. We describe a novel system which uses hybrid 2. 5D/3D integration to compose a state-of-the-art FPGA compute chiplet, three electrical interface chiplets, and three photonic. It comprehensively analyzes the research frontiers and key challenges in packaging technologies, encompassing efficient fiber-to-chip coupling techniques, chip-scale optical interconnection technologies, and 2D, 2. 5D, and 3D stacked co-packaged optics technologies. By synthesizing and summarizing.
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